June 29 – July 2, 2026 · San Francisco, CA · imported from ai.engineer's public schedule feed

AI Engineer World's Fair 2026 — unofficial import demo

Unofficial demo. This programme was imported from the AI Engineer World's Fair's own public schedule feed to show vibeboard at real conference scale. Not affiliated with, or endorsed by, the organisers.

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AI Architects: AI FactoriesSession

What If Your Chip Design Team Moved Like a Single Body?

Khaled Alashmouny, Abduallah Mohamed

When
Thursday, July 211:40 AM – 12:00 PM · 20 min
Where
Leadership 2San Francisco, CA · imported from ai.engineer's public schedule feed
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About this session

Most agentic demos you've seen has a hidden assumption: one user, one session, one task. But what happens when the agent needs to coordinate with 30 other agents, across 10 disciplines, on a project that takes 12 months — where a single miscommunication costs $10-50M? Chip design is that problem. Only 14% of chips succeed on first silicon. The bottleneck isn't individual engineer speed — it's silent divergence between disciplines working from specs that drift without noticing. We built a multiplayer AI on the Anthropic Agent SDK, connected through three alignment layers: a living spec graph (System of Intent) that propagates changes and detects conflicts in real time, a tribal knowledge layer (Memory) that compounds methodology across projects, and milestone-aware execution that drives EDA tools with full design context. Each agent operates within strict spec-hierarchy boundaries enforced at the API level. Cross-agent invocations use structured tool calls with typed parameters, logged for full auditability. We talked with 15 practitioners across 8 major semiconductor and EDA companies. The universal finding: teams need alignment infrastructure, not faster copilots. We'll also share what broke — because coordination tax applies to AI agents too, and the failure modes are surprisingly instructive. This talk covers the multi-agent architecture, evaluation methodology, and lessons from deploying agentic AI in one of engineering's most complex coordination domains.

Speakers (2)

Khaled Alashmouny
Khaled Alashmouny

Founder & CEO, AIDAChip

Khaled Alashmouny is the founder and CEO of AIDAChip, where he is building Multiplayer AI systems for semiconductor engineering teams. His work focuses on a core idea: as AI accelerates individual execution, alignment becomes the dominant bottleneck. AIDAChip tackles this by creating AI teammates that coordinate intent, knowledge, and execution across engineers, tools, and organizational boundaries. Before founding AIDAChip, Khaled spent 20 years in semiconductor engineering, including 13 years leading analog/mixed-signal design at Apple. He designed circuits shipped in products used by hundreds of millions of people and saw firsthand how even world-class teams lose enormous time to fragmented knowledge and coordination overhead. Khaled holds 7 patents, published 9 IEEE papers, and earned his PhD in Electrical Engineering from the University of Michigan. His work sits at the intersection of AI, semiconductor engineering, neuroscience, and organizational systems.

Abduallah Mohamed
Abduallah Mohamed

VP of AI/ML, AIDAChip

VP of AI/ML at AIDAChip, building the AI platform for semiconductor IP development, Ex-Meta. Core expertise spans agentic AI & LLM frameworks, multi-modal sensor fusion, tracking, and multi-agent trajectory prediction. PhD @UT Austin.

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